Micrologic Research

Cellular2002, List of Figures

Chapter 1

 

Figure 1—1 – Worldwide Cellular Handset Shipments
Figure 1—2 – 2001 Share of World Cellular Handset Market
Figure 1—3 - Worldwide Cellular Subscribers
Figure 1—4 – Worldwide Cellular Subscribers by Air Interface
Figure 1—5 – 3G Will Supply Service from 144 kb/s to 2 Mb/s
Figure 1—6 - Worldwide W-CDMA Handset Unit Shipments

 



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Chapter 2

 

Figure 2—1 – “Cellular Telephone” in the Vernacular
Figure 2—2 - Analog Cellular Standards
Figure 2—3 - A Cellular Mobile Telephone System
Figure 2—4 - Comparison of AMPS and NAMPS Radio Parameters
Figure 2—5 - Comparison of GSM, IS-136, and cdmaOne
Figure 2—6 - Comparison of GSM, AMPS, and TACS
Figure 2—7 - A cdmaOne Spread-Spectrum Transmitter

 


 

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Chapter 3

 

Figure 3—1 - Worldwide Cellular Subscribers
Figure 3—2 – Cellular Subscribers by Region
Figure 3—3 – Cellular Subscribers in the Americas
Figure 3—4 – 2001 Latin American Subscribers by Technology
Figure 3—5 – Cellular Subscribers in Europe
Figure 3—6 – Number of Asian Cellular Subscribers
Figure 3—7 – Cellular Subscribers by Air Interface

 



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Chapter 4

 

Figure 4—1 - Brazilian Cellular Telephone Subscribers
Figure 4—2 – Chilean Cellular Subscribers
Figure 4—3 – Chinese Cellular Subscribers
Figure 4—4 – German Cellular Subscribers
Figure 4—5 – Hong Kong Cellular Subscribers
Figure 4—6 —Indian Cellular Subscribers
Figure 4—7 – Indonesian Cellular Subscribers
Figure 4—8 – Italian Cellular Subscribers
Figure 4—9 - Japanese Cellular Subscribers
Figure 4—10 – Malaysian Cellular Subscribers
Figure 4—11 – Mexican Cellular Subscribers
Figure 4—12 – Moroccan Cellular Subscribers
Figure 4—13 – Filipino Cellular Subscribers
Figure 4—14 – Russian Cellular Subscribers
Figure 4—15 - South Korean Cellular Subscribers
Figure 4—16 – Thai Cellular Subscribers
Figure 4—17 – Venezuelan Cellular Service Providers
Figure 4—18 – Venezuelan Cellular Subscriber Forecast

 



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Chapter 5

Figure 5—1 – Worldwide Cellular Handset Shipments
Figure 5—2 – 2001 Share of World Cellular Handset Market
Figure 5—3 – Revenues from Analog Cellular Phone Shipments
Figure 5—4 - Worldwide Analog Cellular Telephone Unit Shipments
Figure 5—5 - ASP of Analog Cellular Phones
Figure 5—6 – Component Cost per Analog Cellular Phone
Figure 5—7 - Analog Cellular Phone Semiconductor Market
Figure 5—8 - Block Diagram of a Digital Cellular Telephone
Figure 5—9 - Revenues from GSM Handset Shipments
Figure 5—10 - GSM Cellular Handset Unit Shipments
Figure 5—11 - ASP of GSM Handsets
Figure 5—12 – Number of GSM Phones with GPRS
Figure 5—13 - Semiconductor Cost per GSM Handset
Figure 5—14 - Worldwide GSM Telephone Semiconductor Market
Figure 5—15 - Worldwide W-CDMA Handset Revenues
Figure 5—16 - Worldwide W-CDMA Handset Unit Shipments
Figure 5—17 – ASP of W-CDMA Handsets 5-19
Figure 5—18 – Worldwide Revenues, IS-136 Phone Shipments
Figure 5—19 - IS-136 Phone Unit Shipments
Figure 5—20 - ASP of IS-136 Cellular Phones
Figure 5—21 - Semiconductor Content per IS-136 Phone
Figure 5—22 - Total Semiconductor Market for IS-136 Phones
Figure 5—23 - cdmaOne Subscribers by Region in September 2001
Figure 5—24 - Dollar Value of CDMA Cellular Phone Shipments
Figure 5—25 - CDMA Cellular Phone Unit Shipments
Figure 5—26 - ASP of cdmaOne Cellular Phones
Figure 5—27 – Average Semiconductor Content per CDMA Phone
Figure 5—28 - cdmaOne Cellular Telephone Semiconductor Market
Figure 5—29 – Revenues from Worldwide PDC Telephone Shipments
Figure 5—30 – PDC Telephone Unit Shipments
Figure 5—31 – PDC Telephone ASP
Figure 5—32 – Average PDC Telephone Semiconductor Content
Figure 5—33 – PDC Telephone Worldwide Semiconductor Market

 

 

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Chapter 6

 

Figure 6—1 – Worldwide Cellular Data Users
Figure 6—2 - CDPD vs. Circuit-Switched
Figure 6—3 – Billions of SMS Messages Sent Worldwide
Figure 6—4 – Worldwide GPRS Subscribers
Figure 6—5 – The WAP Infrastructure
Figure 6—6 – The WAP Protocol Stack
Figure 6—7 – Worldwide Bluetooth-Equipped Cellular Phones
 

 

 

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Chapter 7

 

Figure 7—1 – Upgrading 2G Systems is an Intermediate Step to 3G
Figure 7—2 – 2, 2.5, and 3G Standards Compared
Figure 7—3 – Possible 3G Cellular Services
Figure 7—4 – 3G Cellular Terminals Require MCU and DSP
Figure 7—5 – 3G Will Supply Service from 144 kb/s to 2 Mb/s
Figure 7—6 – Possible 3G Services
Figure 7—7 – Timeline for Developing the IMT2000 RTT
Figure 7—8 – 3G Cellular Band Plans
Figure 7—9 – 3GPP Technical Specification Groups
Figure 7—10 – The IMT-2000 Umbrella Standard
Figure 7—11 – W-CDMA and Broadband cdmaOne Compared
Figure 7—12 - European & NTT 3G Cellular Band Plan
Figure 7—13 – A Dual-Mode GSM/W-CDMA Infrastructure
Figure 7—14 – TDMA Rollout
Figure 7—15 – cdma2000 Protocol Architecture
Figure 7—16 – cdma2000 Base Station Deployment
Figure 7—17 – cdma2000 1xEV-D0 and 1xEV-DV Compared
Figure 7—18 – 1xEV-DO Downlink Transmission Diagram
Figure 7—19 – 1xEV-DO Downlink Speeds and Modulation
Figure 7—20 – The 1xEV-DO Air Interface Protocol Stack
Figure 7—21 – TD-SCDMA Multiplexing

 

 

 

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Chapter 8

 

Figure 8—1 – Agere’s Sceptre 3 System on a Chip
Figure 8—2 – The Agere StarPro 2000 DSP Engine
Figure 8—3 – ADI’s Othello GSM RF Chipset
Figure 8—4 – e-tenna’s FlexScan Variable Delay Line
Figure 8—5 - MultiQuick™ Core Framework Architecture
Figure 8—6 – M-GOLD Receiver Firmware/Hardware Split
Figure 8—7 – Infineon’s M-GOLD Block Diagram
Figure 8—8 – Infineon’s M-GOLD in a 3G Phone
Figure 8—9 – Infineon’s E-GOLD+VD and SMARTi-DC Chips
Figure 8—10 – LSI Logic’s CBP 2.0 IS-95B Baseband Chip
Figure 8—11 – LSI Logic’s CPB4.0 CDMA Baseband Chip
Figure 8—12 – Motorola’s 3G Wireless Handset Platform
Figure 8—13 – Motorola’s MSC8102 DSP Farm on a Chip
Figure 8—14 – Motorola’s GPRS i.250 Chipset
Figure 8—15 – Motorola’s MBC13720 LNA
Figure 8—16 – Evolution from Libris to Openwave Systems
Figure 8—17 – PMC Sierra’s PM7800 Paladin-10
Figure 8—18 – Samsung Indoor and Outdoor BTS
Figure 8—19 - Samsung Indoor &Outdoor BTS Specs
Figure 8—20 – Silicon Labs’ Si4133W RF Synthesizer for W-CDMA       
Figure 8—21 – The StarCore SC140 DSP Core
Figure 8—22 – The StarCore SC110 is a Scaled-Down SC140
Figure 8—23 –Stacked Packaging vs. Tessera’s Folded Package
Figure 8—24 – TI’s TMS320C55x DSP Core
Figure 8—25 – TRF6150 Direct-Conversion GSM Transceiver
Figure 8—26 – TI’s TMS320C6416 DSP for 3G Base Stations
Figure 8—27 – TI’s TSC2500 Chipset for GPRS Smartphones
 

 

 

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